SK hynix begins mass production of 1c SOCAMM2 AI server chips
SK hynix said Monday it has begun mass production of its 192GB small outline compression attached memory module 2 (SOCAMM2), a next‑generation chip for artificial intelligence (AI) servers produced with its sixth-generation 10‑nanometer‑class (1c) process. SOCAMM2 is a server memory module that leverages low-power double data rate (LPDDR) memory chips commonly used for smartphones, aimed at cutting power consumption to roughly one-third of conventional server modules. Designed specifically for AI servers, it uses a thin, high-density form factor, improving signal integrity and making it easier to swap or upgrade. SOCAMM2 is gaining attention among AI data center operators as power efficiency becomes increasingly important for managing total cost of ownership. While commonly used AI memory such as high-bandwidth memory (HBM) is mounted within the package of logic chips such as graphics processing units (GPUs) or central processing units (CPUs), SOCAMM2 is typically placed next to the logic chips on the system board. In this setup, HBM supports computing acceleration, while SOCAMM2 i
