Lee Gyu-lee is a business writer at The Korea Times, focusing primarily on IT & telecommunications, the Ministry of Trade, Industry and Energy and KOTRA. Prior to this, she has covered a wide range of cultural news, from film, television and K-pop to lifestyle and fashion.
Jusung Engineering commercializes ALG transistor integration technology
Jusung Engineering employees pose to celebrate the launch of its atomic layer growth transistor full-integration semiconductor manufacturing equipment. Courtesy of Jusung Engineering
By Lee Gyu-lee
Jusung Engineering announced Monday that it has shipped what it described as the world’s first atomic layer growth (ALG) transistor full-integration semiconductor manufacturing equipment to a global semiconductor company, as it seeks to position itself at the forefront of the next-generation semiconductor market.
The equipment supplier, which operates across semiconductors, displays and solar, said the shipment marks the commercialization of its proprietary technology for advanced transistor manufacturing.
As the global semiconductor industry is evolving at an unprecedented pace with the expansion of artificial intelligence (AI), chip manufacturing technologies are being pushed beyond traditional scaling limits, fueling demand for next-generation architecture.
For decades, chip performance gains have come from shrinking transistor dimensions, or tech migration, allowing more devices to be packed into the same area.
However, as nodes approach physical limits, rising leakage current and power consumption have become critical constraints, prompting leading chipmakers to shift from planar transistor designs to vertically stacked architecture.
A key approach is the shift to vertical channel transistors and other 3D structures, which promise higher electron mobility, improved thermal stability and lower leakage. These designs, however, require highly precise deposition techniques capable of conformal coverage across complex geometries.
These next-generation structures, often paired with new channel materials, aim to deliver higher carrier mobility, lower leakage and improved thermal stability.
Jusung Engineering said its ALG-based transistor full-integration system addresses this challenge by enabling atomic-level film growth with improved uniformity. The system is also capable of depositing films in high-aspect-ratio, vertically stacked structures, setting a new benchmark for next-generation device fabrication.
The company added that its ALG technology is expected to expand beyond semiconductors into display and solar equipment, with potential applications in next-generation displays and renewable energy systems.
Jusung Engineering said it is currently collaborating with global companies across North America, Asia, Europe and the Middle East in those sectors.
“The key is that we are moving beyond simply building process equipment to helping define new standards for semiconductor manufacturing in the AI era,” a company official said.
“We aim to continue shaping new paradigms across the semiconductor, display and solar industries with our world’s first, ‘only one’ innovative technologies.”