Hynix Likely to Issue W600 Bil. Convertible Bonds
By Kim Yoo-chul
Staff Reporter
Hynix Semiconductor, the world’s second-largest dynamic random access memory (DRAM) chipmaker, is likely to issue 600 billion won worth of convertible bonds to finance its business for next year, according to industry sources.
``We are now in the process of confirming our plans for next year’s business, but dates and how it will be financed have not been confirmed yet,’’ Hynix spokesperson Park Hyun told The Korea Times, Monday.