LG Innotek CEO vows to become leader in FC-BGA substrates
LG Innotek CEO and President Jeong Cheol-dong, fourth from right, poses with company officials during an equipment bring-in ceremony at its factory in Gumi, North Gyeongsang Province, in this photo released by the company, Monday. Courtesy of LG InnotekBy Baek Byung-yeulJeong Cheol-dong, CEO and president of LG Innotek, vowed that his company will become a global leader in a next-generation semiconductor packaging substrate known as flip chip ball grid array (FC-BGA), according to the IT parts arm of LG Group, Monday.LG Innotek said it held a ceremony recently at its FC-BGA factory in Gumi, North Gyeongsang Province, to commemorate bringing in equipment. Last June, the company acquired the Gumi 4 factory and has been building a manufacturing line to produce FC-BGA substrates.The new factory will be able to start mass-producing FC-BGA substrates in the second half of this year, the company added.“The FC-BGA substrate is a business that LG Innotek can become a top supplier in as we have led the substrate materials market with the industry's top technology and productivity,”
Jan 30, 2023By Baek Byung-yeul