Samsung mulls new chip packaging plant in Gwangju
Samsung Electronics is doing a feasibility study on establishing a semiconductor packaging plant in the southwestern city of Gwangju, government and industry officials said Wednesday, noting that plans will likely be announced during a presidential meeting later this month. According to officials, Samsung Electronics is now reviewing its investment plan for the new semiconductor packaging plant to address growing memory chip demands and in response to President Lee Jae Myung's push for more balanced regional development. If the plan is finalized, the facility is expected to be responsible for advanced semiconductor packaging for Samsung Electronics' latest chips, including high-bandwidth memory (HBM). Packaging, which comes after the fabrication process in semiconductor manufacturing, was traditionally regarded as a lower-value, less technologically demanding stage, compared with front-end wafer processing, where ultrafine circuits are etched onto wafers using highly sophisticated equipment. However, as artificial intelligence semiconductors become increasingly advanced, the ability to
