Nam Hyun-woo has worked as a staff writer at The Korea Times since 2013, mostly covering business and politics. He currently belongs to the Business Desk where he covers topics such as emerging tech, AI, ICT and Korea's chaebol community. Prior to joining the team, he was the paper's correspondent for the presidential office of Korea during the Yoon Suk Yeol and Moon Jae-in administrations.
LG Innotek expands into vehicle semiconductor market with automotive AP module
LG Innotek's automotive AP modules / Courtesy of LG Innotek
By Nam Hyun-woo
LG Innotek is expanding its automotive components business into the vehicle semiconductor market with the launch of an automotive application processor (AP) module.
The module acts as the vehicle’s brain, similar to a computer’s central processing unit. Installed inside the vehicle, it integrates and controls various electronic systems, including advanced driver-assistance systems (ADAS) and digital cockpits.
As connected car and autonomous driving technologies advance, demand for AP modules is growing. Industry reports project that the number of AP modules installed in vehicles worldwide will rise from 33 million this year to 113 million by 2030, an annual increase of 22 percent.
Existing printed circuit board-based semiconductor chips struggle to process the vast amounts of data required for ADAS and high-resolution digital cockpit displays.
LG Innotek plans to start mass production of its first automotive AP module in the second half of the year and is marketing it to global semiconductor companies, including those in North America.
The module's standout feature is its compact size. Measuring 6.5 centimeters by 6.5 centimeters, it integrates more than 400 components, including a system-on-chip for data, graphics, display and multimedia processing, as well as memory semiconductors and a power management integrated circuit. Its smaller motherboard gives automakers greater design flexibility. Additionally, its high level of integration shortens signal distances between components, significantly improving control performance.
The company plans to further enhance the module. By the end of the year, it aims to improve heat dissipation, allowing it to operate at temperatures up to 95 degrees Celsius. The company is also using virtual simulations to predict warpage, which is expected to shorten development time.
"This development allows us to accelerate the expansion of our semiconductor component business," LG Innotek CEO Moon Hyuk-soo said. "We will continue to introduce products that provide differentiated value to customers and establish ourselves as a trusted innovation partner for global clients."