Lee Min-hyung joined The Korea Times in 2014 and has worked as a journalist mainly in Korea’s finance, tech and automotive industry. He specializes in content creation, breaking news and in-depth analysis currently on transportation and mobility. You can reach him via mhlee@koreatimes.co.kr.
Hyundai Mobis wins top ISO certification for auto chip development
Visitors crowd Hyundai Mobis' booth at this year’s CES tech trade fair in Las Vegas this January 2025 photo. Courtesy of Hyundai Mobis
By Lee Min-hyung
The ISO 26262 certification Hyundai Mobis received for its semiconductor development process / Courtesy of Hyundai Mobis
Hyundai Mobis has received the highest-level ISO certification for its vehicle semiconductor development process from its design to quality verification, the auto parts maker said Thursday.
The ISO 26262 certification, obtained by the company, is an international standard for functional safety in automotive electronics. The certification applies to the entire research and development process of the firm’s semiconductors used for vehicles.
The latest outcome will help Hyundai Mobis accelerate its expansion into the nation’s automotive semiconductor ecosystem through closer partnerships with industry players.
“The certification secures a strategic foundation in the automotive semiconductor sector, which is critical to our future mobility competitiveness,” said Lee Hee-hyun, vice president of the firm’s system semiconductor R&D group.
“We plan to strengthen our R&D environment and expand cooperation both domestically and globally."
The certification follows the company's 2021 acquisition of Hyundai Autron. This enabled the auto parts manufacturer to internalize semiconductor design capabilities.
Hyundai Mobis plans to mass-produce more than 20 million semiconductors of 16 different types by the end of this year. They include integrated chips for airbag systems, power semiconductors for eco-friendly vehicles and semiconductors for motor control and in-vehicle infotainment systems, such as audio, video and navigation.
The company also expressed hopes for a stronger domestic semiconductor value chain by sharing its safety certification know-how and deepening technical collaboration with more partners.
For instance, Hyundai Mobis established a joint lab this year with Global Technologies, a semiconductor design specialist, to codevelop smart ambient lighting systems.
“Hyundai Mobis is strengthening partnerships with leading domestic foundry firms to expand the scope of collaboration in areas such as process optimization and semiconductor packaging,” an official from Hyundai Mobis said.
“We will also enhance cooperation with design houses that serve as intermediaries between fabless and foundry firms as well as others specializing in design, analysis and verification of semiconductors.”