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| A computer-generated illustration of the LG Innotek booth to be set up at the KPCA show 2022 in Songdo, Incheon. / Courtesy of LG Innotek |
By Kim Hyun-bin
LG Innotek announced that it will participate in the International Electronic Circuits and Packaging Show 2022 held at Songdo Convensia in Incheon from Sept. 21 to 23 and introduce new substrate materials, according to the company, Tuesday.
At the exhibition organized by the Korea Electronics Packaging and Circuits Association (KPCA), LG Innotek will unveil three innovative substrate products: flip-chip ball grid array (FC-BGA) substrate, package substrate, and tape substrate.
In the FC-BGA substrate zone, new FC-BGA products scheduled for mass production next year will be unveiled for the first time. An FC-BGA board is utilized to connect a semiconductor chip to a main board and is mainly used in central processing units for devices such as PCs and servers, graphic processing devices and communication chipsets.
The package substrate zone will showcase semiconductor substrates used for mobile wireless communication front-end modules, application processors and memory. In particular, the substrate for radio frequency package substrate (RF-SiP), which has the largest market share in the world, has greatly reduced thickness and signal loss compared to existing products by applying ultra-precision and high-integration technology.
"Based on our global market leadership capabilities, we will expand the substrate material business field from mobile and displays to PCs/servers, communications/networks, the metaverse and vehicles. We will continue to introduce new substrate materials," LG Innotek said.
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