By Bahk Eun-ji
LG Electronics will use Qualcomm's less-powerful mobile application processor in its upcoming G4 smartphone as the U.S. mobile chipset giant's latest chipset has yet to address overheating issues, said a source, Tuesday.
LG said it will unveil the G4 on April 28. It sent official invites to the press for the launching event in six cities ― Seoul, New York, Paris, London, Singapore and Istanbul.
"Instead of using Qualcomm's latest 810 Snapdragon processor, the G4 will use the Snapdragon 808. As far as I know, Qualcomm will be able to resolve overheating issues of the 810 processor chips in the latter half of this year," the source said.
Qualcomm declined to comment.
LG Electronics said its product release plan is subject to the development of Qualcomm chips.
G4 will have a metal-mixture body instead of a plastic back cover as did its predecessors.
Mobile chief Cho Juno said, however, the device will be radically different, one difference possibly being rounded corners.
LG Electronics will use Qualcomm's less-powerful mobile application processor in its upcoming G4 smartphone as the U.S. mobile chipset giant's latest chipset has yet to address overheating issues, said a source, Tuesday.
LG said it will unveil the G4 on April 28. It sent official invites to the press for the launching event in six cities ― Seoul, New York, Paris, London, Singapore and Istanbul.
"Instead of using Qualcomm's latest 810 Snapdragon processor, the G4 will use the Snapdragon 808. As far as I know, Qualcomm will be able to resolve overheating issues of the 810 processor chips in the latter half of this year," the source said.
Qualcomm declined to comment.
LG Electronics said its product release plan is subject to the development of Qualcomm chips.
G4 will have a metal-mixture body instead of a plastic back cover as did its predecessors.
Mobile chief Cho Juno said, however, the device will be radically different, one difference possibly being rounded corners.
