SK hynix shares see record yearly gain from world's first 12-layer HBM3E

The 36-gigabit 12-layer HBM3E chip mass- produced by SK hynix / Courtesy of SK hynix

SK hynix advanced at the sharpest pace this year on the stock market on Thursday as it began the mass production of 12-layer high bandwidth memory (HBM) chips.

The semiconductor arm of SK Group became the first in the world to mass produce the highest capacity and fastest HBM chip to date.

The 36-gigabit 12-layer HBM3E chip will be supplied to U.S. AI chip giant Nvidia within this year, prompting SK hynix to consolidate its market competence against cross-town rivals Samsung Electronics.

Under these circumstances, SK hynix gained 15,600 won, or 9.44 percent, from the previous session’s close, reaching 180,900 won ($136.20) on the benchmark KOSPI on Thursday.

It was the steepest gain SK hynix has experienced so far this year.

The company's share price also returned to the 180,000 won range for the first time since Aug. 23, when it closed at 185,500 won.

It dipped to as low as 152,800 won on Sept. 19 over concerns about the global chip cycle.

“The mass production of 12-layer HBM3E chip is anticipated to push SK hynix upward on the stock market, despite lingering concerns over the industry’s outlook,” said Kim Kwang-jin, an analyst at Hanwha Investment & Securities.

SK hynix first began supplying 8-layer HBM3E chips to Nvidia in March.

Market observers assess that the 12-layer HBM3E chip will dominate the HBM market, citing reports on Nvidia’s upcoming product lineups that feature this chip.