POSCO unveils future-oriented vertiport technology

Spectators examine POSCO's vertiport technology at the company's exhibition booth for the 2025 Drone & UAM Expo, held from Nov. 5 to 7 at KINTEX in Goyang, Gyeonggi Province. Courtesy of POSCO

POSCO said Thursday it unveiled its next-generation vertiport technology for urban air mobility (UAM) at the 2025 Drone & UAM Expo, held from Nov. 5 to 7 at KINTEX in Goyang, Gyeonggi Province.

A vertiport — a combination of “vertical” and “port” — is an airport for vertical takeoff and landing of small automated aircraft that carry passengers or cargo at low altitudes in urban and suburban areas.

During the trade fair, the steelmaker operated an exhibition booth showcasing a miniature model of its vertiport along with its newly developed steel landing-deck system.

“Continuous research and development, as well as government investment, are essential to establishing operational systems and innovative infrastructure for UAM,” a POSCO official said. “POSCO will continue to play a leading role in advancing urban aviation infrastructure.”

Because most vertiports are installed on top of skyscrapers, their pads must be lightweight and impact-resistant to withstand repeated takeoffs and landings by aircraft.

To create lighter, stronger and more cost-effective vertiports, POSCO began developing steel materials and structural technologies in 2023. The effort has resulted in vertiports with high rigidity and durability, thinner profiles and improved economic efficiency.

The company also adopted a prefabrication method, in which modular vertiport components are manufactured in factories and assembled on-site, enhancing both construction efficiency and flexibility.

According to Morgan Stanley, the global UAM market is projected to grow from $8 billion in 2020 to $9.4 trillion by 2050. That vast growth potential underscores the importance of developing vertiport technologies that can guarantee safe, stable takeoffs and landings.