What new semiconductor substrate did LG Innotek unveil at KPCA show 2026?

LG Innotek unveiled an FC-BGA for AI accelerators such as graphics processing units and neural processing units. The substrate measures more than 100 millimeters per side and needed denser circuitry than standard versions.

When does LG Innotek plan to mass-produce its new AI accelerator substrate?

LG Innotek said it aims to begin mass production of the FC-BGA in 2027. The company also said its glass substrate is targeted for mass production in 2028.

LG Innotek shows next-gen chip substrate technology at KPCA show 2026

Q: What other substrate technologies did LG Innotek show at the exhibition?

LG Innotek also displayed chip embedding technology, which places a chip inside the substrate to shorten connections and cut power loss. It showed a glass substrate that replaces the core layer with glass to reduce warping and circuit distortion, plus Econova, which it described as the world’s first smart integrated circuit substrate without precious metals such as palladium or gold.

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Summary

LG Innotek is showcasing its latest semiconductor substrate technology at KPCA show 2026 in Songdo Convensia, Incheon, this week. The company unveiled an FC-BGA for AI accelerators for the first time and said it aims to mass-produce it in 2027. It also displayed chip embedding technology, a glass substrate targeted for mass production in 2028, and Econova, a tape substrate described as the world’s first smart integrated circuit substrate without precious-metal plating.

Key Facts

KPCA show 2026 opened Wednesday at Songdo Convensia in Incheon and is in its 23rd year.
The exhibition is organized by the Korea PCB and Semiconductor Packaging Industry Association and draws roughly 350 domestic and international companies.
LG Innotek said its Package Solution Business posted 935.6 billion won in first-half revenue, up 18 percent from a year earlier.
Operating profit for the business rose 94 percent to 99.6 billion won in the first half.

By Jhoo Dong-chan

Published Sep 9, 2026 2:43 pm KST

An image of LG Innotek's showcase booth during the Korea PCB and Semiconductor Packaging Industry Association show 2026 / Courtesy of LG Innotek

LG Innotek is showcasing its latest semiconductor substrate technology this week at KPCA show 2026, a three-day industry exhibition that opened Wednesday at Songdo Convensia in Incheon.

Now in its 23rd year, the show — organized by the Korea PCB and Semiconductor Packaging Industry Association, known as KPCA — is Korea's largest trade exhibition dedicated to printed circuit boards and semiconductor packaging, drawing roughly 350 domestic and international companies.

LG Innotek's exhibit centers on FC-BGA, or flip chip-ball grid array, a high-end substrate that links semiconductor chips to a device's mainboard. The company unveiled for the first time an FC-BGA built for artificial intelligence (AI) accelerators — chips such as graphics processing units and neural processing units that handle large volumes of data at high speed. The new substrate measures more than 100 millimeters per side and required denser circuitry than standard versions. LG Innotek said it aims to begin mass production of the substrate in 2027.

Also on display were chip embedding technology, which places a chip inside the substrate rather than mounting it on the surface to shorten connections and cut power loss, and a glass substrate that replaces the core layer with glass to reduce warping and circuit distortion, targeted for mass production in 2028.

In its tape substrate lineup, LG Innotek showed Econova, which it described as the world's first smart integrated circuit substrate to achieve high performance without plating with precious metals such as palladium or gold — a feature drawing interest in Europe amid tightening environmental regulations.

"This exhibition offers an intuitive look at how LG Innotek's substrates are used across AI, smartphones and mobility," said Cho Ji-tae, senior vice president and head of the company's Package Solution Business Unit.

The package solution business posted 935.6 billion won ($637 million) in first-half revenue, up 18 percent from a year earlier, with operating profit rising 94 percent to 99.6 billion won.

This article was published with the assistance of generative AI and edited by The Korea Times.

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