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Samsung Electronics Executive Vice President of Memory Global Sales & Marketing Han Jin-man, left, and Naver CLOVA CIC CEO Chung Suk-geun pose after agreeing to collaborate on developing AI semiconductor solutions in this photo provided by Samsung Electronics. |
By Baek Byung-yeul
Samsung Electronics has decided to work together with Naver, the country's top internet company, in developing artificial intelligence (AI), they said Tuesday. The two companies' goal is to develop new semiconductor solutions that will lead to innovation in the emerging AI industry and further boost the country's AI capabilities to compete with global big tech firms.
The two companies said they signed a memorandum of understanding (MOU) for the AI chip business and launched a task force.
To develop AI semiconductor solutions, it is necessary to combine AI technology, software, related services and hardware.
Through the collaboration, the two companies aim to solve bottlenecks in hyperscale AI computing systems and develop new semiconductor solutions that can maximize power efficiency, they said.
"Recent advances in hyperscale AI technology have led to exponential growth in data volumes that need to be processed. However, the performance and efficiency limitations of current computing systems pose significant challenges in meeting these heavy computational requirements, fueling the need for new AI-optimized semiconductor solutions," the two companies said in a joint statement.
"Developing such solutions requires an extensive convergence of semiconductor and AI disciplines. Samsung is combining its semiconductor design and manufacturing expertise with Naver's experience in the development and verification of AI algorithms and AI-driven services, to create solutions that take the performance and power efficiency of large-scale AI to a new level."
Samsung has technological competitiveness and experience from developing memory chip-based technologies to solve system bottlenecks such as high bandwidth memory (HBM) integrated with AI processing power, called HBM-PIM. The processing-in-memory (PIM) architecture brings powerful AI-processing capabilities inside high-performance memory. The new product enables existing computing systems to process data much faster, while data doesn't need to be moved to the system's main CPU for processing.
Naver will continue to refine HyperCLOVA, a hyperscale language model with over 200 billion parameters, while improving its compression algorithms to create a more simplified model that significantly increases computational efficiency.
"Combining our acquired knowledge and know-how from HyperCLOVA with Samsung's semiconductor manufacturing prowess, we believe we can create an entirely new class of solutions that can better tackle the challenges of today's AI technologies," Naver CLOVA CIC CEO Chung Suk-geun said.
Han Jin-man, executive vice president of Memory Global Sales & Marketing at Samsung, said the collaboration between the two companies is aimed to "develop cutting-edge semiconductor solutions to solve the memory bottleneck in large-scale AI systems."